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US 12,593,691 B2Granted
Semiconductor device with two-phase cooling structure including ultrasonic transducer
AssigneeSamsung Electronics Co., Ltd.
InventorsDaehyuk Son, Sungchan Kang, Seogwoo Hong
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Abstract
A semiconductor device includes a semiconductor chip including a semiconductor integrated circuit, and a cooling channel formed in the semiconductor chip and providing a moving path for a coolant. An ultrasonic vibrator may be arranged in the cooling channel. The ultrasonic vibrator may vibrate the coolant. By doing so, the stagnation of vapors and/or generation of a vapor film may be reduced or prevented.
Claims19
A semiconductor device comprising:
- a semiconductor chip comprising a semiconductor integrated circuit;
- a cooling channel formed in the semiconductor chip, the cooling channel configured to provide a path for moving a coolant;
- and
- an ultrasonic vibrator arranged in the cooling channel and configured to vibrate the coolant,
- wherein the ultrasonic vibrator is provided on a lower surface of the cooling channel, and
- wherein the ultrasonic vibrator comprises a plurality of ultrasonic vibrators.
3 more elements
A semiconductor device comprising:
- a semiconductor chip comprising a substrate and a semiconductor integrated circuit formed on a first surface of the substrate;
- a cooling channel formed on the substrate, the cooling channel configured to provide a path for moving a coolant;
- a micro-machined ultrasonic transducer arranged at least partially provided in the coolant in the cooling channel and configured to vibrate the coolant;
- and
- a capillary pattern configured to move the coolant by a capillary force in the cooling channel,
- wherein the capillary pattern is formed on at least a part of a wall of the cooling channel.
3 more elements
An electronic device comprising:
- a substrate comprising a plurality of electronic components;
- a cooling channel, at least a portion of the cooling channel formed in the substrate, the cooling channel configured to provide a path for moving a coolant;
- an ultrasonic vibrator arranged in the portion of the cooling channel formed in the substrate and configured to vibrate the coolant;
- and
- a capillary pattern configured to move the coolant by a capillary force,
- wherein the capillary pattern is formed on at least a part of a wall of the cooling channel.
3 more elements
Dependencies are inferred from the claim text.