Semiconductor workpiece transport pod
AssigneeGudeng Precision Industrial Co., Ltd.
InventorsMing-Chien Chiu, Chia-Ho Chuang, Kuo-Hua Lee, Jyun-Ming Lyu
Life of this patent
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Abstract
A semiconductor workpiece transport pod includes: a lower container, having a top opening; an upper cover, having at least one lateral surrounding groove; and at least one airtight strip, having a base and at least one skirt, the base accommodated in the lateral surrounding groove, the skirt connected to the base and extending outward. When the upper cover is joined with the top opening of the lower container, the skirt of the airtight strip is elastically bent and presses tightly against an inner sidewall of the lower container to form airtightness.
Claims14
A semiconductor workpiece transport pod, comprising:
- a lower container, having a top opening;
- an upper cover, having at least one lateral surrounding groove;
- and
- at least one airtight strip, having a base and at least one skirt, the base accommodated in the lateral surrounding groove, the skirt connected to the base and extending outward,
- wherein when the upper cover is joined with the top opening of the lower container, the skirt of the airtight strip is elastically bent and tightly presses against an inner sidewall of the lower container to form airtightness, and
- wherein the skirt of the airtight strip is two in quantity, and the two skirts are vertically spaced from each other;
- when the upper cover is joined with the top opening of the lower container, a second distance is present between an outer surface of the base and the inner sidewall of the lower container;
- when the two skirts of the airtight strip are not bent, a third distance is present between free ends of the two skirts, and the third distance is greater than or equal to the second distance.
Dependencies are inferred from the claim text.