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US 12,590,995 B2Granted
Power module
AssigneesHyundai Motor Company, Kia Corporation
InventorsTae Hwa Kim, Jin Myeong Yang, Je Hwan Lee
Life of this patent
Estimating the term…
Abstract
A power module includes a first substrate and a second substrate; a semiconductor chip; a resistor electrically connecting the first substrate and the second substrate while being spaced from the semiconductor chip in the horizontal direction, the resistor including a resistance value greater than a resistance value of the metal layer; a first sensing lead connected to a first end portion of the resistor; and a second sensing lead connected to a second end portion of the resistor.
Claims19
A power module comprising:
- a first substrate and a second substrate each including an insulating layer and a metal layer, the first substrate and the second substrate being spaced apart in a vertical direction so that the metal layers of the first substrate and the second substrate face each other;
- a semiconductor chip disposed between the first substrate and the second substrate;
- a resistor disposed between the first substrate and the second substrate to electrically connect the first substrate and the second substrate while being spaced from the semiconductor chip, the resistor including a resistance value greater than a resistance value of the metal layer;
- a first sensing lead connected to a first end portion of the resistor;
- and
- a second sensing lead connected to a second end portion of the resistor.
3 more elements
Dependencies are inferred from the claim text.