Resin sealing apparatus

A resin sealing apparatus for sealing a workpiece with resin and processing the workpiece into a molded product using a sealing mold which comprises an upper mold and a lower mold, the resin sealing apparatus comprising:

• a press device closing and opening the upper mold and the lower mold,
• wherein the press device comprises:
• a fixed platen to which one of the upper mold and the lower mold is fixed,
• a movable platen to which the other one of the upper mold and the lower mold is fixed,
• a tie bar fixing the fixed platen and holding the movable platen so that the movable platen is able to be lifted and lowered, and
• a drive device lifting and lowering the movable platen,
• wherein the fixed platen comprises:
• a main body portion, having a first surface and a second surface opposite to the first surface;
• a fixed portion, fixed to the tie bar on a side of the first surface of the main body portion;
• and
• a bell-shaped portion, disposed on a side of the second surface, wherein one of the upper mold and the lower mold is fixed to the bell-shaped portion,
• wherein the main body portion and the bell-shaped portion are integrally formed by casting, and the main body portion and the bell-shaped portion are provided with a central hole bored in a direction from the first surface toward the second surface, at a central position in a radial direction, and
• the central hole is formed with an inner diameter decreasing stepwise or tapered in a direction from the first surface toward the second surface, wherein the central hole is formed so as not to penetrate to a mold fixing surface of the bell-shaped portion, wherein the fixed portion is provided at a tip portion of an arm portion extended radially at four corners of the main body portion, and the arm portion is configured as a bending generating portion that generates relatively greater bending than other portions by setting stress to be concentrated during mold closing.