Impingement cooling in high power package

A method, comprising:

• providing a device substrate having a first surface and a second surface opposite the first surface;
• forming an electronic component including a semiconductor device package on the first surface of the device substrate;
• providing a cooling substrate having a third surface, a fourth surface opposite the third surface, and a plurality of vias between the third and fourth surfaces, wherein:
• the cooling substrate is coupled to the device substrate,
• the third surface faces the second surface of the device substrate, and
• the second surface and the third surface define a cavity therebetween, such that in use coolant flows from the fourth surface through the plurality of vias to exit at the third surface, and enters the cavity between the second and third surfaces;
• and
• providing a plurality of cavity fin structures coupled directly to the second surface of the device substrate inside the cavity, wherein the plurality of cavity fin structures are configured to interact with the coolant that impinges on the plurality of cavity fin structures to direct, and dissipate, heat generated by the electronic component;
• wherein the electronic component is coupled to the first surface of the device substrate of the cavity, and includes a top surface, a rear surface opposite to the top surface;
• wherein one or more external fin structures are exposed to air and individually coupled to the top surface of the electronic component;
• and
• wherein the electronic component is external to the cavity, and configured to dissipate the heat from:
• (i) the top surface via the one or more external fin structures and (ii) from the rear surface via the plurality of cavity fin structures;
• and
• wherein each of the first, second, third, and fourth surfaces has a respective surface area of approximately 10×6 mm2.