Module tray for semiconductor device

A module tray for a semiconductor device, comprising:

• a case body having a base plate, and the case body defining at least one cavity therein as an accommodating space for accommodating a semiconductor substrate,
• wherein the case body defines
• a first inner wall and a second inner wall of the at least one cavity respectively extending in a first horizontal direction, the first inner wall and the second inner wall respectively having first end portions and second end portions that are inclined at a first inclination angle and a second inclination angle from a bottom surface of the at least one cavity, respectively,
• a third inner wall and a fourth inner wall of the at least one cavity respectively extending in a second horizontal direction orthogonal to the first horizontal direction, the third inner wall and the fourth inner wall respectively having third end portions and fourth end portions that are inclined at a third inclination angle and a fourth inclination angle from the bottom surface, respectively, and
• a first guide groove extending from the first inner wall to the third inner wall, a second guide groove extending from the third inner wall to the second inner wall, a third guide groove extending from the second inner wall to the fourth inner wall, and a fourth guide groove extending from the fourth inner wall to the first inner wall,
• each of the first guide groove, the second guide groove, the third guide groove and the fourth guide groove having a continuous curved surface, and having a concave shape configured to guide the semiconductor substrate into the accommodating space,
• wherein the first inner wall, the second inner wall, the third inner wall and the fourth inner wall respectively further include a first support portion, a second support portion, a third support portion and a fourth support portion that are configured to respectively extend horizontally to, and end, at the first guide groove, the second guide groove, the third guide groove and the fourth guide groove, and to support the semiconductor substrate accommodated into the at least one cavity, and
• each of the first support portion, the second support portion, the third support portion and the fourth support portion has a curvature shape.

A module tray for a semiconductor device, comprising:

• a case body having a base plate, and defining at least one cavity therein as an accommodating space to accommodate a semiconductor substrate,
• wherein the case body defines
• a first inner wall and a second inner wall of the at least one cavity extending parallel to each other in a first horizontal direction, the first inner wall and the second inner wall respectively having first end portions and second end portions inclined at a first inclination angle and a second inclination angle with respect to the base plate, respectively,
• a third inner wall and a fourth inner wall of the at least one cavity extending parallel to each other in a second horizontal direction orthogonal to the first horizontal direction, the third inner wall and the fourth inner wall respectively having third end portions and fourth end portions inclined at a third inclination angle and a fourth inclination angle with respect to the base plate, respectively, and
• a first guide groove extending from the first inner wall to the third inner wall, a second guide groove extending from the third inner wall to the second inner wall, a third guide groove extending from the second inner wall to the fourth inner wall, and a fourth guide groove extending from the fourth inner wall to the first inner wall,
• the first guide groove, the second guide groove, the third guide groove and the fourth guide groove each having a continuous curved surface, and having a half funnel shape narrowing toward the base plate and configured to guide corner portions of the semiconductor substrate to the accommodating space, respectively,
• wherein the first inner wall, the second inner wall, the third inner wall and the fourth inner wall respectively further include a first support portion, a second support portion, a third support portion and a fourth support portion that are configured to respectively extend horizontally to, and end at, the first guide groove, the second guide groove, the third guide groove and the fourth guide groove, and to support the semiconductor substrate accommodated into the at least one cavity, and
• each of the first support portion, the second support portion, the third support portion and the fourth support portion has a curvature shape.