Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsYuning Tsai, Yoshiko Takahashi, Daisuke Inoue
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsYuning Tsai, Yoshiko Takahashi, Daisuke Inoue
Estimating the term…
A semiconductor device includes: a semiconductor chip having a first surface, a second surface, a first electrode provided on the first surface, a second electrode provided on the second surface, and a third electrode provided on the second surface; a first conductor including a fourth conductor and a fifth conductor; a conductive first connector provided between the first conductor and the first electrode; a second conductor including a sixth conductor and a seventh conductor; a conductive second connector provided between the second electrode and the sixth conductor; a third conductor including an eighth conductor, an intermediate conductor, and a ninth conductor, the intermediate conductor being provided between the eighth conductor and the ninth conductor, the eighth conductor being provided between the semiconductor chip and the intermediate conductor, and the intermediate conductor having a through hole; and a conductive third connector.
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.