Node and electronic device
AssigneeHuawei Technologies Co., Ltd.
InventorsXiaoguang Sun, Junen Gao, Huan Peng
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to heat dissipation apparatuses. In an example, a node includes a structural module, a circuit board, a liquid pipe, and a liquid leakage monitoring apparatus. The circuit board is securely mounted on the structural module, and an electronic component including a chip is disposed on the circuit board. The liquid pipe is disposed on the circuit board, and is configured to dissipate heat for the electronic component on the circuit board. The liquid leakage monitoring apparatus includes a drainage pipe sleeved outside the liquid pipe. There is a specific gap between the drainage pipe and the liquid pipe. In response to at least that leakage occurs in the liquid pipe, leaked coolant flows in the drainage pipe.
Claims20
A node, comprising:
- a circuit board, disposed with an electronic component;
- a liquid pipe comprising coolant in the liquid pipe, wherein the coolant is used to dissipate heat for the electronic component;
- a liquid leakage monitoring apparatus, comprising a drainage pipe, a liquid receiving tray, and a first liquid leakage sensor, wherein the drainage pipe is sleeved outside the liquid pipe, the drainage pipe is connected to the liquid receiving tray and is configured to direct the coolant leaked from the liquid pipe into the liquid receiving tray, the first liquid leakage sensor is disposed in the liquid receiving tray, and in response to at least detecting the leaked coolant in the liquid receiving tray, the first liquid leakage sensor sends an alarm signal;
- and
- a liquid isolation area comprising an opening configured to allow the leaked coolant to flow into the liquid isolation area after the liquid receiving tray is filled.
An electronic device, comprising a cabinet body and a node, wherein the node is disposed in the cabinet body and comprises:
- a circuit board, disposed with an electronic component;
- a liquid pipe comprising coolant in the liquid pipe, wherein the coolant is used to dissipate heat for the electronic component;
- a liquid leakage monitoring apparatus, comprising a drainage pipe, a liquid receiving tray, and a first liquid leakage sensor, wherein the drainage pipe is sleeved outside the liquid pipe, the drainage pipe is connected to the liquid receiving tray and is configured to direct the coolant leaked from the liquid pipe into the liquid receiving tray, the first liquid leakage sensor is disposed in the liquid receiving tray, and in response to at least detecting the leaked coolant in the liquid receiving tray, the first liquid leakage sensor sends an alarm signal;
- and
- a liquid isolation area comprising an opening configured to allow the leaked coolant to flow into the liquid isolation area after the liquid receiving tray is filled.
Dependencies are inferred from the claim text.