Connection method for yarn wire and circuit board
AssigneesNextronics Engineering Corp., Makalot Industrial Co., Ltd.
InventorsHou-An Su, Kuan-Wen Chen
Life of this patent
Estimating the term…
Abstract
A connection method for a yarn wire and a circuit board includes steps as follows: providing at least one yarn wire, a back adhesive, and a circuit board, at least one through hole is formed on the circuit board, and a diameter D of the through hole, a diameter d of the at least one yarn wire, a shrunken diameter dmin of the yarn wire being stretched, and a jig thickness t of a jig have a relation of: 2d>D>2dmin+t; placing the yarn wire on the back adhesive, aligning the yarn wire having the back adhesive with the through hole, and extruding and passing the yarn wire through the through hole by using the jig to penetrate the back adhesive; pulling the jig out along a pulling direction; and adhering a fixing back adhesive to one side of the circuit board.
Claims9
A connection method for a yarn wire and a circuit board, comprising processes of:
- providing at least one yarn wire, a back adhesive layer, and a circuit board;
- wherein the circuit board has a first side and a second side opposite to the first side, at least one through hole penetrates through the first side and the second side of the circuit board, wherein a diameter of the through hole is defined as D, an original diameter of the at least one yarn wire is defined as d;
- providing a jig, wherein one end of the jig has a holding portion, the holding portion is plate-shaped and has a jig thickness of t, a width of the holding portion is smaller than the diameter of the through hole, the holding portion includes two holding bars and a retaining groove formed between the two holding bars;
- wherein the retaining groove is configured to accommodate the at least one yarn wire;
- placing the at least one yarn wire on the back adhesive layer, aligning the yarn wire with the through hole of the circuit board, the back adhesive layer fixing the at least one yarn wire on the first side of the circuit board;
- and
- using the jig to penetrate through the back adhesive layer along an assembly direction such that the yarn wire is extruded into and passes through the through hole to extend beyond the second side of the circuit board, wherein the yarn wire is stretched and attached to both sides of the holding portion, and has a shrunken diameter dmin during stretching, wherein the diameter D of the through hole is greater than a sum of the jig thickness t of the holding portion and twice the shrunken diameter dmin;
- pulling the jig out along a pulling direction, wherein the yarn wire applies a frictional force and an abutting normal force on an inner wall of a periphery of the through hole, and a portion of the yarn wire that passes through the through hole forms a protruding wire segment in a shape of a round loop;
- wherein the protruding wire segment of the yarn wire expands and is restored to the original diameter due to the stretching being stopped so that the diameter of the through hole, the original diameter of the at least one yarn wire, the shrunken diameter of the yarn wire being stretched, and the jig thickness have a relation of:
- 2d>D>2dmin+t;
- and
- adhering a fixing back adhesive to the second side of the circuit board, wherein the fixing back adhesive is adhered to the circuit board and the protruding wire segment so that the yarn wire and the circuit board are connected and fixed to each other.
Dependencies are inferred from the claim text.