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US 12,557,582 B2Granted
Laser pressure head module and laser bonding apparatus including the same
AssigneeSamsung Display Co., Ltd.
InventorsJong Hyup Kim, Jin Pyung Lee, Gil Jun Kim, Yong Hwan Kim, Min Ho Bae, Hae Wook Yang
Life of this patent
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Abstract
A laser pressure head module including: a pressure member including: a first light-transmitting member; a second light-transmitting member; and a sealed space between the first light-transmitting member and the second light-transmitting member; and a gas supply unit to supply gas to the sealed space to generate a pressing force. The second light-transmitting member is to be expanded or moved in an external direction by the pressing force.
Claims28
A laser pressure head module comprising:
- a pressure member comprising:
- a first light-transmitting member;
- a second light-transmitting member;
- and
- a sealed space between the first light-transmitting member and the second light-transmitting member;
- and
- a gas supply unit configured to supply gas to the sealed space to generate a pressing force,
- wherein the second light-transmitting member is configured to be expanded or moved in an external direction by the pressing force.
5 more elements
A laser bonding apparatus comprising:
- a support member having an upper surface extending in a first direction and a second direction crossing the first direction, the support member configured to receive bonding targets seated on the upper surface;
- a pressure member on an upper portion of the support member, the pressure member comprising:
- a first light-transmitting member;
- a second light-transmitting member;
- and
- a sealed space between the first light-transmitting member and the second light-transmitting member;
- a gas supply unit configured to supply gas to the sealed space to generate a pressing force;
- and
- a laser generator on the pressure member, and configured to irradiate a laser beam to the bonding targets in a third direction crossing the first and second directions,
- wherein the second light-transmitting member is configured to be expanded or moved in an external direction by the pressing force to press the bonding targets.
7 more elements
Dependencies are inferred from the claim text.