Method for manufacturing semiconductor device, method for manufacturing film material for temporary fixing, and film material for temporary fixing

A method for manufacturing a semiconductor device, the method comprising:

• forming a laminated body for temporary fixing, the laminated body including a support substrate having a support surface and a back surface on an opposite side thereof, a light-absorbing layer, and a resin layer for temporary fixing having a first principal surface and a second principal surface on an opposite side thereof, the light-absorbing layer and the resin layer for temporary fixing being laminated in this order on the support surface;
• temporarily fixing a semiconductor member on the resin layer for temporary fixing by curing the resin layer for temporary fixing;
• and
• separating the semiconductor member from the resin layer for temporary fixing by:
• irradiating the laminated body for temporary fixing with light from the back surface side;
• and
• peeling off the resin layer for temporary fixing from the semiconductor member after irradiating the laminated body,
• wherein the laminated body for temporary fixing is formed by:
• preparing a film material for temporary fixing having the resin layer for temporary fixing, a first release film, and a second release film, the first release film, the resin layer for temporary fixing, and the second release film being laminated in this order so that the first release film is in contact with the first principal surface of the resin layer for temporary fixing, and the second release film is in contact with the second principal surface of the resin layer for temporary fixing;
• peeling off the first release film from the film material for temporary fixing, and laminating the film material for temporary fixing on the light-absorbing layer provided on the support surface so that the exposed first principal surface of the resin layer for temporary fixing is in contact with the light-absorbing layer;
• and
• peeling off the second release film from the film material for temporary fixing and exposing the second principal surface of the resin layer for temporary fixing,
• wherein maximum values of logarithmic decrements of the first principal surface and the second principal surface of the resin layer for temporary fixing in rigid pendulum measurement are respectively designated as δmax1 and δmax2, and δmax2 is smaller than δmax1, and
• wherein the logarithmic decrements are measured over a temperature range below a curing temperature of the resin layer for temporary fixing.