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US 12,534,593 B2Granted
Encapsulation composition
AssigneeLG Chem, Ltd.
InventorsSeung Min Lee, Yeong Bong Mok, Sung Nam Moon, Se Woo Yang
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Abstract
The present disclosure relates to an encapsulation composition, an encapsulation film comprising the same, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation composition capable of effectively blocking moisture or oxygen introduced into an organic electronic device from the outside and realizing an organic electronic device with an extremely small bezel part structure.
Claims13
An encapsulation composition comprising:
- an encapsulation resin comprising an olefinic resin selected from the group consisting of polyisobutylene and butyl rubber,
- a moisture adsorbent surface-treated with an aliphatic hydrocarbon compound, and a tackifier having a softening point of 102° C. to 120° C.,
- wherein the aliphatic hydrocarbon compound comprises at least one or more polar functional groups,
- wherein the aliphatic hydrocarbon compound has a carbon number in a range of 10 to 40,
- wherein the moisture adsorbent is comprised in a range of 300 to 1000 parts by weight relative to 100 parts by weight of the encapsulation resin,
- wherein the tackifier is comprised in a range of 150 to 400 parts by weight relative to 100 parts by weight of the encapsulation resin, and
- wherein the moisture adsorbent surface-treated with an aliphatic hydrocarbon compound is CaO surface-treated with stearic acid.
4 more elements
Dependencies are inferred from the claim text.