Microelectromechanical systems die
AssigneeKnowles Electronics, LLC
InventorsYunfei Ma, Ann George, Shubham Shubham
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Abstract
A microelectromechanical system (MEMS) die includes a substrate, a diaphragm made from a conductive material and supported over the substrate, and a backplate separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate. The backplate includes a central electrode layer disposed on a surface facing the diaphragm, and a ring electrode layer disposed on the surface facing the diaphragm, the ring electrode layer spaced from and surrounding the central electrode layer.
Claims18
A microelectromechanical system (MEMS) die, comprising:
- a substrate;
- a diaphragm made from a conductive material and supported over the substrate;
- and
- a backplate separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate;
- wherein the backplate comprises a central electrode layer disposed on a surface facing the diaphragm, and a ring electrode layer disposed on the surface facing the diaphragm, the ring electrode layer spaced from and surrounding the central electrode layer;
- and
- wherein the central electrode layer and the ring electrode layer are electrically connected to a common voltage source.
A microelectromechanical system (MEMS) die, comprising:
- a substrate;
- a diaphragm made from a conductive material and supported over the substrate;
- and
- a backplate separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate;
- wherein the backplate comprises a central electrode layer disposed on a surface facing the diaphragm, wherein the central electrode layer is connected to a voltage source, and wherein the minimum required level of voltage applied to the central electrode layer to overcome surface stiction between the diaphragm and the substrate is a first predetermined level of voltage;
- the backplate further comprising a ring electrode layer disposed on the surface facing the diaphragm, the ring electrode layer spaced from and surrounding the central electrode layer, and wherein the ring electrode layer is further connected to the voltage source so that the minimum required level of voltage applied to the central electrode layer and the ring electrode layer to overcome surface stiction between the diaphragm and the substrate is a second predetermined level of voltage that is less than the first predetermined level of voltage.
A microelectromechanical system (MEMS) die, comprising:
- a substrate;
- a diaphragm made from a conductive material and supported over the substrate by a cantilevered anchor extending from an edge of the diaphragm;
- a backplate separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate;
- and
- a plurality of posts extending from the backplate toward the diaphragm, wherein the plurality of posts is spaced from and surrounding the central electrode layer, and wherein the ring electrode layer comprises a plurality of ring segments, wherein the ring segments alternate with the posts, and wherein the ring segments are connected by smaller connector segments;
- wherein the backplate comprises a central electrode layer disposed on a surface facing the diaphragm, and a ring electrode layer disposed on the surface facing the diaphragm, the ring electrode layer spaced from and surrounding the central electrode layer.
Dependencies are inferred from the claim text.