Adhesive for provisionally fixing electronic component to solder precoat and method for producing electronic component mounted substrate
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsYuki Yoshioka, Tadahiko Sakai, Tadashi Maeda, Shingo Okamura
Life of this patent
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Abstract
An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. The content of the solvent is 25 mass % or more and 40 mass % or less, and the organic film dissolves in the solvent when the solder precoat is melted. According thereto, the formation of an oxide film on the surface of the solder precoat can be suppressed, and poor connection between the electrode having the solder precoat and the electronic component can be suppressed.
Claims6
A method for producing a circuit member on which an electronic component is mounted, the method comprising steps of:
- preparing the circuit member, the circuit member having a solder precoat covered at least partially with an organic film;
- applying an adhesive for temporarily fixing the electronic component on the solder precoat, so as to cover at least part of the organic film;
- placing the electronic component on the solder precoat, with the adhesive interposed between the electronic component and the solder precoat;
- and
- reflowing the solder precoat, to mount the electronic component on the circuit member;
- wherein
- the adhesive includes a principal resin, and a solvent dissolving the principal resin,
- a content of the solvent is 25 mass % or more and 40 mass % or less, and
- the organic film dissolves in the solvent when the solder precoat is reflowed.
Dependencies are inferred from the claim text.