Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin Uk Lee, Chi Won Hwang, Eun Sun Kim
Life of this patent
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Abstract
A printed circuit board includes: a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; and a bridge embedded in the wiring substrate and having a plurality of connection pads thereon. An uppermost wiring layer of the plurality of wiring layers includes a plurality of bump pads connected to the plurality of connection pads, and a pitch between at least two adjacent connection pads of the plurality of connection pads is larger than a pitch between at least two adjacent ones of the plurality of bump pads.
Claims11
A printed circuit board comprising:
- a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers;
- and
- a bridge embedded in at least one of the plurality of insulating layers of the wiring substrate at a depth such that an upper surface of a body of the bridge is below an upper surface of a wiring layer of the plurality of wiring layers disposed on the at least one of the plurality of insulating layers of the wiring substrate, and having a plurality of connection pads disposed on the upper surface of the body of the bridge,
- wherein an uppermost wiring layer of the plurality of wiring layers includes a plurality of bump pads connected to the plurality of connection pads,
- the plurality of connection pads include a row of connection pads spaced apart from each other,
- the plurality of bump pads include a row of bump pads spaced apart from each other, and
- each distance between center lines of every two adjacent connection pads of the row of connection pads is larger than each distance between center lines of every two adjacent bump pads of the row of bump pads,
- the plurality of connection pads have a size greater than the plurality of bump pads.
Dependencies are inferred from the claim text.