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US 12,470,190 B2Granted
Blackened wafers and method for manufacturing the same, and wave filter device having the same
AssigneeFujian Jing'an Optoelectronics Co., Ltd.
InventorsYilin Liu, Zhonghe Lin, Yenfu Lin, Shihwei Huang, Minghui Fang, Shengyu Yang
Life of this patent
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Abstract
A method for blackening at least one wafer includes: (a) performing a reduction treatment on the at least one wafer; and (b) illuminating the at least one wafer with an ultraviolet light. The at least one wafer after the illumination of the UV light has a blackening uniformity value (DE value) smaller than 0.6, and a chromatic value (L value) smaller than 54. In addition, a blackened wafer made from the method is also provided.
Claims16
A method for blackening at least one wafer, comprising the steps of:
- (a) performing a reduction treatment on the at least one wafer;
- and
- (b) illuminating the at least one wafer with an ultraviolet (UV) light,
- wherein the at least one wafer after the illumination of the UV light has a blackening uniformity value (DE value) smaller than 0.6, and a chromatic value (L value) ranging from 46 to 54.
1 more element
Dependencies are inferred from the claim text.