Composition for encapsulation
AssigneeLG Chem, Ltd.
InventorsSo Young Kim, Seung Min Lee, Eun Gu Han, Se Woo Yang
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides an encapsulation composition which can form an encapsulation structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifespan of the organic electronic device and implementing endurance reliability of the encapsulation structure at high temperature and high humidity, and has high shape retainability, and an organic electronic device comprising the same.
Claims19
An encapsulation composition comprising:
- a non-reactive olefin-based compound;
- and
- a reactive olefin-based compound included in a range of 10 to 150 parts by weight relative to 100 parts by weight of the non-reactive olefin-based compound,
- wherein the reactive olefin-based compound has an active energy ray-curable functional group, and
- wherein the active energy ray-curable functional group includes a vinyl group, an acryloyl group or a methacryloyl group.
Dependencies are inferred from the claim text.