Heat pump
AssigneeLG Electronics Inc.
InventorsYoungmin Lee, Jihyeong Ryu, Eunjun Cho, Minsoo Kim
Life of this patent
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AssigneeLG Electronics Inc.
InventorsYoungmin Lee, Jihyeong Ryu, Eunjun Cho, Minsoo Kim
Estimating the term…
A heat pump is provided that includes a first pipe in which a first refrigerant flows; a second pipe disposed at a side of the first pipe and in which a second refrigerant flows; a first heat exchanger connected with the first pipe and the second pipe and in which the first refrigerant exchanges heat with the second refrigerant; a boiler connected with the first pipe and in which the first refrigerant flows; a compressor connected with the second pipe and that compresses the second refrigerant; a second heat exchanger connected with the second pipe and in which the second refrigerant exchanges heat with outdoor air; a bypass pipe branched from first pipe and configured to exchange heat with the second heat exchanger; and a three-way valve that directs the first refrigerant to pass through the bypass pipe. When the outdoor heat exchanger operates as an evaporator, frost formation thereon may be prevented.
A heat pump, comprising:
Dependencies are inferred from the claim text.