Method of manufacturing a MEMS device

A method of manufacturing a MEMS device, said device comprising

• a main body, and
• a protrusion protruding from the main body;
• wherein the method comprises performing a series of steps on a monocrystalline wafer substrate, wherein the wafer substrate comprises a first main side and a second main side opposite of the first main side;
• wherein the steps comprise
• creating a first recess in the wafer substrate at the first main side, said first recess comprising an upper recess section and a lower recess section, creating said first recess comprising
• creating the upper recess section in the wafer substrate using anisotropic etching,
• performing corner lithography, involving the steps of
• providing a mask at the nadir of the upper recess section,
• growing a cover layer inside the upper recess section and outside the mask,
• removing the mask at the nadir, and
• performing directional etching using the cover layer as a mask so as to form the lower recess section;
• introducing filler material in the first recess,
• forming a second recess in the wafer substrate adjacent to the first recess and at a side chosen from the first main side and the second main side, wherein creating said second recess comprises the following steps
• performing anisotropic etching so as to form a cavity with a wall of said cavity intersecting the lower recess section of the first recess provided with filler material;
• and
• using the plane of the wall to define a barrier and etching the filler material using said barrier, and
• removing at least part of the wafer substrate material so as to expose the filler material introduced in the first recess.