Polymer latex for dip-molding applications

A polymer latex for dip-molding applications obtained by free-radical emulsion polymerization of a mixture of ethylenically unsaturated monomers comprising at least one conjugated diene and at least one ethylenically unsaturated nitrile compound, wherein the unsaturated nitrile is present in amounts of at least 22 wt.-% based on the total weight of the ethylenically unsaturated monomers in an aqueous medium in presence of seed latex particles having a glass transition temperature (mid point temperature Tmg) measured by DSC according to ASTM D3418-03 of −40° C. to 50° C. wherein the seed latex particles do not contain structural units derived from ethylenically unsaturated nitrile compounds, wherein the seed latex particles comprise structural units derived from 80 to 99.95 wt.-% of alkyl esters of ethylenically unsaturated acids, and 0.05 to 10 wt.-% of ethylenically unsaturated acids, based on the total weight of monomers constituting the seed particles, and wherein a z-average particle size measured with a Malvern zetasizer nano S (ZEN 1600) using dynamic light scattering of the seed latex particles is 10 to 80 nm.