Resin composition, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

A resin composition containing

• a polyphenylene ether compound (A),
• a styrene block copolymer (B),
• a polybutadiene compound (C),
• a curing agent (D), and
• a silane coupling agent (E) having a triazine ring,
• the polyphenylene ether compound (A) having, in a molecule thereof, at least one of a group expressed by the following formula (1) or a group expressed by the following formula (2):
• where p indicates an integer falling within a range from 0 to 10, Z indicates an arylene group, and R1 to R3 each independently indicate either a hydrogen atom or an alkyl group,
• where R4 indicates either a hydrogen atom or an alkyl group,
• the polybutadiene compound (C) having an epoxy group in a molecule thereof, and
• the curing agent (D) containing an allyl compound (d1) expressed by the following formula (3):
• where RA indicates either an alkyl group or an alkenyl group, each having 8 to 22 carbon atoms.