Solid-state imaging device and imaging method
AssigneeSony Semiconductor Solutions Corporation
InventorSatoshi Keino
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AssigneeSony Semiconductor Solutions Corporation
InventorSatoshi Keino
Estimating the term…
A solid-state imaging device includes an imaging element array that includes M imaging elements arranged in a first direction and N imaging elements arranged in a second direction, that is, M×N imaging elements in total, each of the imaging elements including a photoelectric conversion unit that includes a photoelectric conversion layer 21, an insulation layer 32, a charge discharge electrode 22, an upper electrode 23, and a charge accumulation electrode 24. The photoelectric conversion layer is provided as a common layer at least for the N imaging elements. The photoelectric conversion unit of each of the imaging elements further includes a first charge transfer control electrode 25, a second charge transfer control electrode 26, and a light shielding layer 12. The photoelectric conversion layer 21 includes a photoelectric conversion layer-first region 21A, a photoelectric conversion layer-second region 21B, and a photoelectric conversion layer-third region 21C. The light shielding layer 12 covers at least the photoelectric conversion layer-second region 21B and the photoelectric conversion layer-third region 21C.
A solid-state imaging device, comprising:
An imaging method that uses a solid-state imaging device including an imaging element array that includes M (M≥2) imaging elements arranged in a first direction and N (N≥2) imaging elements arranged in a second direction different from the first direction, that is, M×N imaging elements in total, each of the imaging elements including a photoelectric conversion unit that includes:
Dependencies are inferred from the claim text.