Apparatus for transporting semiconductor wafers

A method for producing a transport container for transporting semiconductor wafers, the method comprising:

• using a 3D printing to produce the transport container with a mandated shape from a base material;
• applying, in at least a region of a surface of the transport container, a coating material configured for protection from chemicals capable of etching the semiconductor wafers, the coating material being applied with a low-temperature sintering process below 150° C., the coating material consisting of one of polytetrafluoroethylene, a perfluoroalkoxy polymer, and polyvinylidene fluoride,
• wherein the mandated form of the transport container comprises a device in a base that is configured for removing liquid media,
• wherein the mandated form of the transport container comprises one or more integrated workpiece holders for semiconductor wafers or carriers for semiconductor wafers, so that the semiconductor wafers to be transported can be loaded in standing form, and
• wherein the transport container is configured such that a designated transport direction of the transport container in an automatic transport system runs parallel to a front side or a rear side of the semiconductor wafers.