Method for manufacturing solar cell, solar module, and power generation system

A method for manufacturing a solar cell, comprising:

• step S1:
• perforating a film layer in a first region and/or a second region of a solar cell comprising a substrate where an electrode is to be disposed, thus forming a plurality of holes or grooves;
• step S2:
• growing a seed layer on the solar cell, wherein the seed layer comes into conductive contact with the first region and/or the second region through the plurality of holes or grooves in step S1;
• and
• step S3:
• horizontally transporting a to-be-electroplated solar cell, wherein a cathode electroplating brush is in contact with the seed layer on the horizontally transported solar cell, to form a cathode of an electroplating system on the seed layer, an anode terminal is disposed in an electroplating liquid in an electroplating bath, and a moving mechanism disposed in the electroplating bath drives the solar cell to move from an inlet to an outlet of the moving mechanism of the solar cell, thus achieving electroplating of the solar cell during energization and the horizontal transportation to form an electroplated electrode region comprising electroplated electrodes;
• wherein:
• a conductive layer is disposed on the seed layer, and the conductive layer consists of Cu;
• and
• the seed layer comprises a main component and an additional component;
• the main component is Al having a mass content greater than or equal to 70 wt. % of the seed layer, and the additional component comprises any one or more of Mo, Ti, Pd, Bi, Nb, Ta, and Pa;
• and the additional component has a mass content less than or equal to 30 wt. % of the seed layer, thereby providing adhesion of the seed layer to the conductive layer.

A method for manufacturing a solar cell, comprising:

• step S1:
• perforating a film layer in a first region and/or a second region of a solar cell comprising a substrate where an electrode is to be disposed, thus forming a plurality of holes or grooves;
• step S2:
• growing a seed layer on the solar cell, wherein the seed layer comes into conductive contact with the first region and/or the second region through the plurality of holes or grooves in step S1;
• and
• step S3:
• horizontally transporting a to-be-electroplated solar cell, wherein a cathode electroplating brush is in contact with the seed layer on the horizontally transported solar cell, to form a cathode of an electroplating system on the seed layer, an anode terminal is disposed in an electroplating liquid in an electroplating bath, and a moving mechanism disposed in the electroplating bath drives the solar cell to move from an inlet to an outlet of the moving mechanism of the solar cell, thus achieving electroplating of the solar cell during energization and the horizontal transportation to form an electroplated electrode region comprising electroplated electrodes;
• wherein:
• the seed layer comprises a main component and an additional component;
• the main component is Al having a mass content greater than or equal to 70 wt. % of the seed layer, and the additional component comprises any one or more of W, Cr, Mn, Pd, Bi, Nb, Ta, and Pa;
• and the additional component has a mass content less than or equal to 30 wt. % of the seed layer;
• and
• a conductive layer is disposed on the seed layer, and the conductive layer comprises Cu.

A method for manufacturing a solar cell, comprising:

• step S1:
• perforating a film layer in a first region and/or a second region of a solar cell comprising a substrate where an electrode is to be disposed, thus forming a plurality of holes or grooves;
• step S2:
• growing a seed layer on the solar cell, wherein the seed layer comes into conductive contact with the first region and/or the second region through the plurality of holes or grooves in step S1;
• and
• step S3:
• horizontally transporting a to-be-electroplated solar cell, wherein a cathode electroplating brush is in contact with the seed layer on the horizontally transported solar cell, to form a cathode of an electroplating system on the seed layer, an anode terminal is disposed in an electroplating liquid in an electroplating bath, and a moving mechanism disposed in the electroplating bath drives the solar cell to move from an inlet to an outlet of the moving mechanism of the solar cell, thus achieving electroplating of the solar cell during energization and the horizontal transportation to form an electroplated electrode region comprising electroplated electrodes;
• wherein:
• the seed layer consists of a main component and an additional component;
• the main component is Al having a mass content greater than or equal to 70 wt. % of the seed layer, and the additional component is a metal selected from Mo, Ti, W, Cr, Mn, Pd, Bi, Nb, Ta, and Pa;
• and the additional component has a mass content less than or equal to 30 wt. % of the seed layer;
• and
• a conductive layer is disposed on the seed layer, and the conductive layer comprises Cu.