Moisture-curable adhesive composition
AssigneeTOYOBO MC Corporation
InventorsHideyuki Sakata, Kenji Kashihara
Life of this patent
Estimating the term…
Abstract
An object of this invention is to provide an adhesive composition that comprises a moisture-curable resin and a modified polyolefin and that achieves an excellent liquid state and excellent adhesion to polyolefin resin substrates. Provided is a moisture-curable adhesive resin composition comprising a moisture-curable resin (A) and a modified polyolefin resin (B), wherein the content of the modified polyolefin resin (B) is 2 parts by mass or more per 100 parts by mass of the moisture-curable resin (A).
Claims10
An adhesive resin composition comprising a moisture-curable resin (A) and a modified polyolefin resin (B), wherein the content of the modified polyolefin resin (B) is 2 parts by mass or more and 100 parts by mass or less, per 100 parts by mass of the moisture-curable resin (A),
- wherein the moisture-curable resin (A) is a resin containing a hydrolyzable silyl group at an end and having a main chain comprising a polyether or (meth)acrylate,
- wherein the modified polyolefin resin (B) has a polyether structure or a (meth)acrylate polymer structure, and
- wherein the modified polyolefin resin (B) is a polyolefin resin having a structure similar to that of the main skeleton of the moisture-curable resin (A).
Dependencies are inferred from the claim text.