Back to results
US 12,249,463 B2Granted
Multi-terminal MLCC for improved heat dissipation
AssigneeKemet Electronics Corporation
InventorsMark R. Laps, John Bultitude, Philip M. Lessner, Lonnie G. Jones, Allen Templeton, Nathan A. Reed
Life of this patent
Estimating the term…
Abstract
Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.
Claims39
A heat dissipating electronic device comprising:
- internal electrodes of opposing polarity forming a capacitive couple between external terminations wherein said internal electrodes are in coplanar pairs of opposing polarity;
- a dielectric between said internal electrodes;
- at least one thermal dissipation layer wherein said at least one thermal dissipation layer is between adjacent said coplanar pairs;
- at least one thermal conductive terminal wherein said at least one thermal dissipation layer is in electrically conductive contact with said thermal conductive terminal and said thermal conductive terminal is not in electrical contact with said external terminations, and said thermal conductive terminal does not contribute to electrical functionality of said capacitive couple wherein said thermal conductive termination is in thermal conductive contact with a thermal dissipation trace wherein said thermal dissipation trace does not contribute to electrical functionality of said capacitive couple;
- and
- a substrate comprising active traces and said thermal dissipation trace wherein said active traces are in electrical contact with said external terminations.
3 more elements
A heat dissipating electronic device comprising:
- internal electrodes of opposing polarity forming a capacitive couple between external terminations;
- a dielectric between said internal electrodes;
- at least one thermal dissipation layer wherein said at least one thermal dissipation layer is not coplanar with an internal electrode of said internal electrodes wherein said at least one thermal dissipation layer has a thickness of no more than 5 times the thickness of said inner electrodes and wherein said at least one thermal dissipation layer is coplanar with at least one inner electrode of said internal electrodes and between coplanar said internal electrodes and wherein said thermal dissipation layer is in thermal conductive contact with a thermal dissipation trace wherein said thermal dissipation trace is not electrically connected to said capactive couple;
- at least one thermal conductive termination wherein said at least one thermal dissipation layer is in electrically conductive contact with said thermal conductive termination and said at least one thermal dissipation layer is in not in electrical contact with said external terminations;
- and
- a substrate comprising active traces and said thermal dissipation trace wherein said active traces are in electrical contact with said external terminations.
3 more elements
Dependencies are inferred from the claim text.