Semiconductor device
AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorRyo Kanda
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AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorRyo Kanda
Estimating the term…
A semiconductor device includes: a semiconductor base body including: a p-type substrate; and an n-type first semiconductor layer; a first electrode; a second electrode; an isolation film; an insulation film; and a third electrode disposed over the insulation film. The first electrode is electrically connected to a first circuit C1 that is connected to a first power source Vin. The second electrode is electrically connected to a second circuit C2 that is connected to a second power source Vcc. The semiconductor base body further includes a p-type back gate region that is formed in at least a region of the semiconductor base body that faces the third electrode by way of the insulation film with a depth that allows the back gate region to reach the substrate. A dopant concentration of the back gate region falls within a range of 1×1010 cm−3 to 1×1015 cm−3.
A semiconductor device comprising:
Dependencies are inferred from the claim text.