Surface-mounted heat sink and power module using same

A power module comprising:

• a circuit board comprising a surface, an upper side and a lower side opposite to each other, and the surface is connected between the upper side and the lower side;
• a magnetic element disposed adjacent to the upper side of the circuit board, and covering at least one portion of the surface of the circuit board;
• at least one power device disposed on the surface of the circuit board, and located between the magnetic element and the lower side of the circuit board;
• and
• at least one surface-mounted heat sink disposed on the surface of the circuit board and adjacent to the at least one power device, wherein a limiting height is defined by a top surface disposed on one side of the magnetic element and the surface of the circuit board, a first height is defined by a sucked surface and a surface-mounted surface of the surface-mounted heat sink, and the limiting height is greater than or equal to the first height,
• wherein the surface-mounted heat sink comprises a surface-mounted portion comprising the surface-mounted surface attached to the surface of the circuit board.