Server packaging for immersion cooling with local acceleration
AssigneeBaidu USA LLC
InventorTianyi Gao
Life of this patent
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AssigneeBaidu USA LLC
InventorTianyi Gao
Estimating the term…
A cooling unit includes a channel frame assembled to a server chassis to form a region enclosing an electronic chip that is disposed on a server board contained within the server chassis, an inlet port coupled to a first side of the channel frame to receive a coolant fluid, an outlet port coupled to a second side of the channel frame for coolant fluid in either a liquid phase or a vapor phase to exit the channel frame, and an internal structure disposed on an inner surface of the channel frame between the inlet port and the outlet port. The internal structure guides the coolant fluid flow and/or distribution along a surface of the electronic chip, where the electronic chip transfers heat to the coolant fluid to cause a portion of the coolant fluid to change from a liquid to a vapor phase.
A cooling unit, comprising:
A server, comprising:
A cooling system, comprising:
Dependencies are inferred from the claim text.