Cooling system for the liquid immersion cooling of electronic components

A cooling system for liquid immersion cooling of electronic components comprising:

• a container having an interior and containing, in the interior, liquid heat transfer fluid, the electronic components being immersible in the liquid heat transfer fluid, the container further including a gas space above a surface of the liquid heat transfer fluid;
• a heat exchanger device in the gas space of the container for forming the liquid heat transfer fluid;
• and
• a lock device on the container for exchanging the electronic components, the lock device having a lock space, the lock space being hermetically sealed with respect to the gas space of the container to prevent gas exchange;
• wherein the lock device and/or the container includes a degassing device, the degassing device separating non-condensable gases from gaseous heat transfer fluid.

A cooling system for liquid immersion cooling of electronic components comprising:

• a container having an interior and containing, in the interior, liquid heat transfer fluid, the electronic components being immersible in the liquid heat transfer fluid, the container further including a gas space above a surface of the liquid heat transfer fluid;
• a heat exchanger in the gas space of the container for forming the liquid heat transfer fluid;
• a lock device on the container for exchanging the electronic components, the lock device having a lock space, the lock space being hermetically sealed with respect to the gas space of the container to prevent gas exchange;
• and
• a gas connection, the lock device being flooded with a protective gas via the gas connection.