Manufacturing method of continuous sheet for circuit board production and continuous sheet for circuit board production manufactured therefrom

A manufacturing method of a continuous sheet for circuit board production comprising:

• providing at least two or more sheet type metal laminates, each of which including a metal foil, adjoined in series in a length direction of the metal foil, and
• winding an adhesion substrate one or more turns around a perimeter of an adjoining portion of the adjoined sheet type metal laminates,
• wherein the adhesion substrate includes a first adhesion substrate and a second adhesion substrate,
• wherein the step of winding an adhesion substrate includes:
• winding the first adhesion substrate 0.5 turns to 1.5 turns around the perimeter of the adjoining portion of the adjoined sheet type metal laminates;
• and
• winding the second adhesion substrate 0.5 turns to 1.5 turns around the perimeter of the adjoining portion of the adjoined sheet type metal laminates, around which the first adhesion substrate has been wound, subsequently to the first adhesion substrate.