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US 12,225,665 B2Granted
Circuit system and method of manufacturing a printed circuit board
AssigneeNVIDIA Corporation
InventorsMingYi Yu, Greg Bodi, Ananta Attaluri
Life of this patent
Estimating the term…
Abstract
A circuit system and method of manufacturing a printed circuit board includes providing an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of side pins around a periphery of the cutout.
Claims20
A circuit system comprising:
- an integrated circuit package mounted on a first side of a printed circuit board;
- a power regulator disposed within a cutout region of the printed circuit board, wherein power terminals in a central region of the integrated circuit package are in direct contact with power terminals of the power regulator within a periphery of the cutout region;
- and
- wherein the power regulator is configured to draw power from the printed circuit board by way of side pins mounted around the cutout.
1 more element
A circuit system comprising:
- a graphics processing unit mounted on a first side of a printed circuit board;
- a power regulator disposed within a cutout region of the printed circuit board, wherein power terminals in a central region of the graphics processing unit are in direct contact with power terminals of the power regulator within a periphery of the cutout region;
- and
- the power regulator coupled to a power plane of the printed circuit board via side pins around a periphery of the cutout.
1 more element
A method of manufacturing a printed circuit board, the method comprising:
- forming a cutout in the printed circuit board, the cutout having an area less than a footprint of an integrated circuit package;
- mounting the integrated circuit package over the cutout on a first side of the printed circuit board;
- disposing a power regulator within the cutout and making direct contact between power terminals of the power regulator and power terminals in a central region of the integrated circuit package overlapping the cutout;
- and
- interfacing the power regulator to a power plane of the printed circuit board by way of side pins around a periphery of the cutout.
2 more elements
Dependencies are inferred from the claim text.