Interlaced crosstalk controlled traces, vias, and capacitors

A method comprising:

• routing, on a first internal layer in a multilayer printed circuit board, a first pair of traces, electrically connected to first vias of a first trace and via structure, between second vias of a second trace and via structure;
• routing, on a second internal layer in the multilayer printed circuit board, a second pair of traces, electrically connected to the second trace and via structure, between the first vias of the first trace and via structure;
• backdrilling the first vias of the first trace and via structure to a first depth;
• and
• backdrilling the second vias of the second trace and via structure to a second depth that is deeper than the first depth,
• wherein the first pair of traces and the second pair of traces run parallel to one another, and
• wherein the first vias of the first trace and via structure are separated by a first distance and the second vias of the second trace and via structure are separated by a second distance that is less than the first distance.

A method comprising:

• assembling a multilayer printed circuit board comprising a stackup of layers including an upper half of the stackup and a lower half of the stackup;
• routing in the upper half of the stackup, on a first internal layer of the multilayer printed circuit board, a first pair of traces, electrically connected to first vias of a first trace and via structure, between second vias of a second trace and via structure;
• routing in the upper half of the stackup, on a second internal layer of the multilayer printed circuit board, a second pair of traces, electrically connected to the second vias of the second trace and via structure, between the first vias of the first trace and via structure;
• backdrilling from the lower half of the stackup the first vias of the first trace and via structure to a first depth;
• and
• backdrilling from lower half the second vias of the second trace and via structure to a second depth that is deeper than the first depth,
• wherein the first vias of the first trace and via structure are separated by a first distance and the second vias of the second trace and via structure are separated by a second distance that is less than the first distance.