Semiconductor device package and method of manufacturing the same

A semiconductor device package, comprising:

• a substrate;
• and
• an antenna module disposed over the substrate, the antenna module comprising:
• a supporting element;
• an antenna pattern disposed over the supporting element;
• a pad;
• a conductive pillar penetrating the supporting element and electrically connecting the antenna pattern to the pad;
• a first dielectric layer disposed below the supporting element and having an opening;
• and
• an electrical contact partially disposed within the opening of the first dielectric layer, and connecting the pad and the substrate,
• wherein a lower surface of the pad is exposed from the opening of the first dielectric layer, and the pad directly contacts the conductive pillar and the electrical contact.