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US 12,224,390 B2Granted
Electronic component mounting substrate and electronic device
AssigneeKYOCERA Corporation
InventorsKouichirou Sugai, Kazuki Nishimoto
Life of this patent
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Abstract
An electronic component mounting substrate includes: a metal substrate including a first surface, an insulation substrate including a second surface on which a first metal layer having a frame shape is provided, and a bonding material that bonds the first surface and the first metal layer. The bonding material is located in a region that includes the first metal layer and that is surrounded by the first metal layer in a plane perspective.
Claims6
An electronic component mounting substrate, comprising:
- a metal substrate comprising a first surface;
- an insulation substrate comprising a second surface having at least one metal layer having a thickness projecting therefrom that covers a portion of the second surface such that the second surface is divided into an area covered by the at least one metal layer and an area uncovered by any metal layer the at least one metal layer including a first metal layer having a frame shape disposed proximate a perimeter of the insulation substrate second surface and surrounding a portion of the uncovered area;
- and a layer of bonding material that bonds the first surface and the first metal layer that extends beneath the first metal layer and the area the first metal layer surrounds and that extends upwardly in the portion of the uncovered area that is surrounded by the frame shape less than the projecting thickness of the first metal layer whereby the bonding layer absorbs stress due to differential heat expansion characteristics between the metal substrate and the insulation substrate.
Dependencies are inferred from the claim text.