Component arrangement, package and package arrangement, as well as production method

A component arrangement, comprising:

• a carrier substrate;
• a spacer which is arranged on the carrier substrate so as to surround an installation space and has an outlet opening on a side facing away from the carrier substrate;
• an optical component arranged in the installation space;
• a contact connection which electrically conductively connects the optical component to external contacts arranged outside the installation space;
• a cover substrate which is arranged on the spacer and with which the outlet opening is covered in a light-permeable manner;
• and
• a light-reflecting surface which is formed on an anisotropically etched silicon component and is arranged in the installation space as an inclined surface at an angle of approximately 45° relative to a surface of the carrier substrate facing the installation space, in such a way that light radiated in a horizontal direction onto the light-reflecting surface can be radiated out in a vertical direction through the opening and the cover substrate, and vice versa, wherein the spacer is formed from the anisotropically etched silicon component;
• wherein the outlet opening has, in plan view, an opening with a trapezoidal shape;
• wherein the anisotropically etched silicon component, in a plan view, has a lower opening with a trapezoidal shape and an upper opening with a trapezoidal shape that is limited in one direction of its extent.