PGaN enhancement mode HEMTs with dopant diffusion spacer
AssigneeIntel Corporation
InventorsMichael Beumer, Robert Ehlert, Nicholas Minutillo, Michael Robinson, Patrick Wallace, Peter Wells
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AssigneeIntel Corporation
InventorsMichael Beumer, Robert Ehlert, Nicholas Minutillo, Michael Robinson, Patrick Wallace, Peter Wells
Estimating the term…
III-N e-mode high electron mobility transistors (HEMTs) including a dopant diffusion spacer between an impurity-doped III-N material layer and a III-N polarization layer of the HEMT material stack. The spacer may be a substantially undoped III-N material, such as GaN. With the diffusion spacer, P-type impurities within the pGaN are setback from the polarization layer sufficiently to avoid significant levels of P-type impurities from entering the III-N material interface where the 2DEG resides. With the diffusion spacer, clustering of impurities near the 2DEG may be avoided and a III-N e-mode HEMT may achieve higher drive currents.
A Group III-nitride (III-N) transistor, comprising:
A system comprising:
An apparatus, comprising:
Dependencies are inferred from the claim text.