Integrated circuit and method of forming the same

An integrated circuit comprising:

• a set of active regions extending in a first direction, and being on a first level of a substrate;
• a first contact extending in a second direction different from the first direction, being on a second level different from the first level, and overlapping at least a first active region of the set of active regions;
• a set of gates extending in the second direction, overlapping the set of active regions, and being on a third level different from the first level;
• a first conductive line extending in the first direction, and overlapping the first contact, and being on a fourth level different from the first level, the second level and the third level;
• a second conductive line extending in the first direction, being on the fourth level, overlapping the first contact, and being adjacent to the first conductive line;
• and
• a first slot via between the first contact and each of the first conductive line and the second conductive line, the first slot via extending from at least the first conductive line to at least the second conductive line, the first slot via electrically coupling the first contact, the first conductive line and the second conductive line together.

A method of fabricating an integrated circuit, the method comprising:

• fabricating a set of active regions of a set of transistors in a front-side of a substrate, the set of active regions extending in a first direction;
• depositing a first conductive material over the set of active regions on a first level thereby forming a set of contacts, the set of contacts including a first contact, the first contact extending in a second direction different from the first direction, and overlapping at least a first active region of the set of active regions;
• fabricating a set of gates over the set of active regions on a second level, the set of gates extending in the second direction, the set of gates overlapping the set of active regions, and being between the set of contacts;
• fabricating a first set of vias over the first contact, the first set of vias including a first via and a second via;
• and
• depositing a second conductive material over at least the set of contacts on a third level thereby forming a first set of signal lines, the third level being above the first level and the second level, the first set of signal lines including a first conductive line and a second conductive line extending in the first direction, and overlapping the first contact;
• wherein the first via is between the first contact and the first conductive line, and the first via electrically couples the first contact and the first conductive line together;
• and
• the second via is between the first contact and the second conductive line, and the second via electrically couples the first contact and the second conductive line together.