3D semiconductor packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee, Liang-Ju Yen
Life of this patent
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Abstract
A semiconductor package includes a first die, a first heat conduction block and a first encapsulant. The first die has a bottom surface, a top surface and a sidewall between the bottom surface and the top surface. The first heat conduction block has a bottom surface, a top surface and a sidewall between the bottom surface and the top surface. The first encapsulant is disposed between the sidewall of the first die and the sidewall of the first heat conduction block.
Claims20
A semiconductor package, comprising:
- a first die having a bottom surface, a top surface and a sidewall between the bottom surface and the top surface;
- a silicon block having a bottom surface, a top surface and a sidewall between the bottom surface and the top surface;
- a first encapsulant, disposed between the sidewall of the first die and the sidewall of the silicon block, wherein the top surface of the silicon block is coplanar with a top surface of the first encapsulant;
- and
- an adhesive adhered to the bottom surface of the silicon block.
A semiconductor package, comprising:
- a first die having a bottom surface, a top surface and a sidewall between the bottom surface and the top surface;
- at least one semiconductor block comprising a semiconductor material, extending along the sidewall of the first die, wherein the at least one semiconductor block is free of active device and passive device;
- an encapsulant, wherein the encapsulant encapsulates opposite sidewalls of the at least one semiconductor block;
- and
- an adhesive adhered to a bottom surface of the at least one semiconductor block.
A semiconductor package, comprising:
- a first die;
- a semiconductor block, disposed aside the first die, wherein the at least one semiconductor block is free of active device and passive device;
- and
- a heat conduction block, adhered to the semiconductor block through an adhesive.
Dependencies are inferred from the claim text.