Fan-out packages providing enhanced mechanical strength and methods for forming the same

A fan-out package comprising:

• a primary semiconductor die that comprises a primary single crystalline semiconductor substrate having a first <100> crystallographic direction along a first crystallographic lattice direction and is laterally surrounded by a primary-level molding compound layer, wherein the primary semiconductor die comprises a first pair of primary-die sidewalls that are parallel to a first horizontal direction and a second pair of primary-die sidewalls that are parallel to a second horizontal direction and perpendicular to the first horizontal direction;
• and
• a first complementary die that comprises a complementary single crystalline semiconductor substrate having a second <100> crystallographic direction along a second crystallographic lattice direction and overlies or underlies, and is bonded to, the primary semiconductor die, is laterally surrounded by a complementary-level molding compound layer, and comprises a first pair of complementary-die sidewalls laterally extending along a third horizontal direction and comprises a second pair of complementary-die sidewalls laterally extending along a fourth horizontal direction that is perpendicular to the first pair of complementary-die sidewalls,
• wherein the fan-out package comprises at least one feature selected from:
• a first feature that the third horizontal direction is not parallel to the first horizontal direction or the second horizontal direction;
• a second feature that the first <100> crystallographic direction is aligned along a primary <100> crystallographic lattice direction that is azimuthally offset from the first horizontal direction and from the second horizontal direction by at least 0.5 degree;
• and
• a third feature that the second <100> crystallographic direction is aligned along a complementary <100> crystallographic lattice direction that is azimuthally offset from the first horizontal direction and from the second horizontal direction by at least 0.5 degree.

A fan-out package comprising:

• a primary semiconductor die that comprises a primary single crystalline semiconductor substrate having a first <100> crystallographic direction along a first crystallographic lattice direction, and comprising a first pair of primary-die sidewalls that are parallel to a first horizontal direction and a second pair of primary-die sidewalls that are parallel to a second horizontal direction and perpendicular to the first horizontal direction;
• and
• a first complementary die that comprises a complementary single crystalline semiconductor substrate having a second <100> crystallographic direction along a second crystallographic lattice direction and overlies or underlies, and is bonded to, the primary semiconductor die, and comprising a first pair of complementary-die sidewalls laterally extending along a third horizontal direction and comprises a second pair of complementary-die sidewalls laterally extending along a fourth horizontal direction that is perpendicular to the first pair of complementary-die sidewalls,
• wherein the fan-out package comprises at least one feature selected from:
• a first feature that the third horizontal direction is not parallel to the first horizontal direction or the second horizontal direction;
• a second feature that the first <100> crystallographic direction is aligned along a primary <100> crystallographic lattice direction that is azimuthally offset from the first horizontal direction and from the second horizontal direction by at least 0.5 degree;
• and
• a third feature that the second <100> crystallographic direction is aligned along a complementary <100> crystallographic lattice direction that is azimuthally offset from the first horizontal direction and from the second horizontal direction by at least 0.5 degree.