Three-dimensional stacking structure and manufacturing method thereof

A stacking structure, comprising:

• a first die having first through die vias penetrating through the first die;
• a second die, disposed on a first side of the first die and having second through die vias penetrating through the second die, wherein the first and second dies have substantially a same span, the first through die vias are bonded with the second through die vias, and the first through die vias have first critical dimensions different from second critical dimensions of the second through die vias;
• a redistribution layer disposed on a second side of the first die opposite to the first side;
• a third die, disposed at the first side of the first die and directly bonded to the second die, wherein the second die is located between the first die and the third die, the third die has conductive features embedded in a dielectric film and the conductive features of the third die are bonded with the second through die vias of the second die, and the first, second and third dies are electrically connected;
• and
• conductive bumps disposed on the redistribution layer.

A stacking structure, comprising:

• a first die having first through die vias penetrating through the first die;
• a second die, disposed on a first side of the first die and having second through die vias penetrating through the second die, wherein the first and second dies have substantially a same span, the first through die vias are bonded with the second through die vias, and the first through die vias have first critical dimensions different from second critical dimensions of the second through die vias;
• a redistribution layer disposed on a second side of the first die opposite to the first side;
• a third die, disposed at the first side of the first die and on the second die, wherein the second die is located between the first die and the third die, the third die has conductive features embedded in a dielectric film and the conductive features of the third die are bonded with the second through die vias of the second die, and the first, second and third dies are electrically connected;
• and
• an encapsulant laterally wrapping around the third die, wherein sidewalls of the first and second dies are aligned with and coplanar with sidewalls of the encapsulant.