Magnetic inductor device and method

A semiconductor device comprising:

• a semiconductor chip coupled to a package substrate;
• and
• a voltage regulator circuit at least partially imbedded within the package substrate, the voltage regulator circuit including:
• an electrical transmission pathway including:
• a core;
• a dielectric layer on a lower and an upper surfaces of the core;
• at least one first electrical transmission pathway in the core, including:
• a magnetic material disposed on an inner circumferential surface of the at least one electrical transmission pathway;
• at least one second electrical transmission pathway extending within the magnetic material;
• a nickel layer disposed on an inner circumferential surface of the magnetic material at least within the second electrical transmission pathway;
• a copper layer disposed on the nickel layer, wherein:
• the dielectric spacer separates the copper layer from the magnetic material;
• and
• at least one third pathway extending through at least one of the dielectric layer and the core separate from the at least one first electrical transmission pathway.

A method of forming a semiconductor substrate comprising:

• forming at least one first pathway through a core having and upper and lower surface;
• filling the first pathway with a magnetic material;
• disposing a dielectric layer on the upper and lower surface of the core;
• forming at least one second pathway through the dielectric spacer and the magnetic material;
• disposing a nickel layer on at least an inner circumferential surface of the magnetic material;
• forming a third pathway separate from at least the first pathway or second pathway;
• and
• disposing a copper layer on exposed layers of at least one of the nickel layer and the dielectric layer.