Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads

A device, comprising:

• a package that includes:
• a first lead that includes a first internal surface and a second internal surface that is transverse to the first internal surface, the first internal surface including a first plurality of cavities;
• a second lead that includes a third internal surface and a fourth internal surface that is transverse to the third internal surface, the first internal surface facing the third internal surface, the third internal surface including a second plurality of cavities, the second lead includes a fifth internal surface and a sixth internal surface, the fifth internal surface is opposite the fourth internal surface, the sixth internal surface is transverse the fifth internal surface, ones of the second plurality of cavities are in the fifth and sixth internal surfaces;
• and
• an encapsulant on the first, second, third, and fourth internal surfaces, the encapsulant being in the first plurality of cavities on the first internal surface and the second plurality of cavities on the third internal surface of the second lead.

A device, comprising:

• a package that includes:
• a die pad that includes a first plurality of cavities and a first recessed portion, the first recessed portion has a first surface transverse a second surface, ones of the first plurality of cavities are in the first and second surfaces;
• a lead that includes a second plurality of cavities and a second recessed portion, the second recessed portion has a third surface transverse a fourth surface, the third surface of the lead faces the first surface of the die pad, ones of the second plurality of cavities are in the third and fourth surfaces;
• and
• an encapsulant on the die pad and the lead, the encapsulant being in the first and second plurality of cavities.

A device, comprising:

• a package that includes:
• a die pad that includes:
• a first surface;
• a first recessed portion in the first surface, the first recessed portion has a second surface transverse a third surface;
• a fourth surface opposite the first surface;
• and
• a plurality of cavities, first ones of the plurality of cavities are in the second, third, and fourth surfaces;
• and
• an encapsulant on the die pad and in the first ones of the plurality of cavities.