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US 12,224,249 B2Granted
Package module comprising marking and shield films and method of manufacturing the same
AssigneeMurata Manufacturing Co., Ltd.
InventorsToru Komatsu, Tadashi Nomura
Life of this patent
Estimating the term…
Abstract
A module is disclosed that includes a substrate having a first main surface, a first component mounted on the first main surface, a first sealing resin disposed so as to cover the first main surface and the first component, a marking film covering at least an upper surface of the first sealing resin, and a shield film covering the marking film. An upper surface of the marking film is locally formed with a first recess.
Claims20
A module comprising:
- a substrate having a first main surface;
- a first component mounted on the first main surface;
- a first sealing resin disposed to cover the first main surface and the first component;
- a marking film covering at least an upper surface of the first sealing resin and having an upper surface opposite the first sealing resin that comprises a first recess locally disposed therein, and a lower surface adjacent to the upper surface of the first sealing resin that is a completely uniform surface;
- and
- a shield film covering the marking film.
3 more elements
A module comprising:
- a substrate having a main surface;
- an electronic component mounted on the main surface of the substrate;
- a sealing resin that covers the main surface of the substrate and the electronic component;
- a marking film that covers the sealing resin opposite the substrate and that has a surface opposite the sealing resin that includes a first recess extending therein towards the sealing resin, and a lower surface adjacent to the surface of the sealing resin that is a completely uniform surface;
- and
- a shield film that covers the marking film and includes a surface opposite the marking film with a second recess that aligns with the first recess of the marking film.
3 more elements
A method of manufacturing a module, the method comprising:
- preparing a collective substrate;
- mounting a plurality of components on a first main surface of the collective substrate;
- disposing a first sealing resin to cover the first main surface and the plurality of components;
- forming a marking film to cover an upper surface of the first sealing resin;
- forming a plurality of first recesses by irradiating an upper surface of the marking film with a laser beam;
- cutting the collective substrate into a plurality of module blanks;
- and
- forming a shield film on each of the plurality of module blanks to cover an upper surface and a side surface thereof.
5 more elements
Dependencies are inferred from the claim text.