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US 12,224,244 B2Granted
Package substrate and semiconductor structure with same
AssigneeChangxin Memory Technologies, Inc.
InventorHailin Wang
Life of this patent
Estimating the term…
Abstract
There is provided a package substrate and a semiconductor structure with the same. The package substrate includes a body and a plurality of conducive bridges. The body includes an opening region. The plurality of conductive bridges are disposed separately in the opening region, and adjacent conductive bridges have a respective distance value. At least two of the distance values are not equal.
Claims19
A package substrate, comprising:
- a body including an opening region;
- and
- a plurality of conductive bridges disposed separately in the opening region, and adjacent conductive bridges among the plurality of conductive bridges having a respective distance value, and there are a plurality of distance values among of the plurality of conductive bridges;
- and,
- wherein at least two distance values among the plurality of distance values are not equal;
- and
- the plurality of conductive bridges comprise:
- a first conductive bridge provided with a first through hole.
5 more elements
A package substrate, comprising:
- a body including an opening region;
- and
- a plurality of conductive bridges comprising a first conductive bridge, a second conductive bridge and a third conductive bridge, the first conductive bridge, the second conductive bridge and the third conductive bridge being disposed in sequence in the opening region;
- and,
- wherein a distance value between the first conductive bridge and the second conductive bridge is not equal to a distance value between the second conductive bridge and the third conductive bridge;
- and
- the first conductive bridge provided with a first through hole.
4 more elements
A package substrate, comprising:
- a body including an opening region, the opening region comprising a first side wall and a second side wall opposite to each other, and a packaging glue entering the opening region from the first side wall and flowing to the second side wall;
- and
- a plurality of conductive bridges disposed separately in the opening region;
- wherein conductive bridges, among the plurality of conductive bridges, close to the first side wall are arranged more densely than conductive bridges, among the plurality of conductive bridges, close to the second side wall;
- and,
- wherein the plurality of conductive bridges comprise:
- a first conductive bridge provided with a first through hole.
4 more elements
Dependencies are inferred from the claim text.