Semiconductor device and substrate

A semiconductor device comprising:

• a substrate;
• a semiconductor chip provided over the substrate;
• and
• a sealing resin which is provided over the substrate and seals the semiconductor chip,
• wherein:
• the substrate includes
• a wire layer including a wire electrically connected to the semiconductor chip, and
• an insulating layer provided in contact with the wire layer and including a glass woven fabric containing a resin,
• the glass woven fabric includes a plurality of glass fibers that are provided along two or more directions parallel with the glass woven fabric and are woven,
• the glass fibers differ in at least one of a material, a number, and a thickness depending on the directions parallel with the glass woven fabric,
• the glass woven fabric includes the glass fibers provided along a first direction and the glass fibers provided along a second direction different from the first direction,
• the glass fibers provided along the first direction have a lower coefficient of thermal expansion than the glass fibers provided along the second direction,
• a shape of an outer edge of the semiconductor chip as seen in a direction of a normal to a substrate surface of the substrate is substantially rectangular,
• the first direction is a direction along long sides of the semiconductor chip,
• the second direction is a direction along short sides of the semiconductor chip, and
• the resin accounts for a larger part of a cross-sectional area along the short sides than a cross-sectional area along the long sides.