Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers

A packaged electronic device, comprising:

• a dielectric substrate;
• a first metal cladding layer on a lower side of the dielectric substrate;
• a lead frame that has an upper side that comprises a die pad region and a lower side that is on an upper side of the dielectric substrate;
• a first power semiconductor die that is on the die pad region of the lead frame;
• a first metal braze layer between the first metal cladding layer and the dielectric substrate;
• and
• a second metal braze layer on the upper side of the dielectric substrate, wherein the second metal braze layer is directly attached to both the upper side of the dielectric substrate and to the lower side of the lead frame.

A packaged electronic device, comprising:

• a dielectric substrate;
• a first metal braze layer on an upper surface of the dielectric substrate;
• a thermally-conductive adhesive paste;
• a lead frame on the first metal braze layer;
• a first metal cladding layer on a lower side of the dielectric substrate;
• a second metal braze layer between the first metal cladding layer and the dielectric substrate;
• a power semiconductor die that is mounted on an upper side of the lead frame;
• an overmold encapsulation that surrounds an upper side and side surfaces of the power semiconductor die and at least partially surrounds sidewalls of the dielectric substrate while exposing at least a portion of the first metal cladding layer;
• and
• a first lead and a second lead that each extend through the overmold encapsulation and that are electrically connected to the power semiconductor die,
• wherein the power semiconductor die is electrically isolated from the first metal cladding layer, and
• wherein the first metal braze layer is directly attached to the dielectric substrate and to a second metal cladding layer.