Packaged component with composite pin structure and manufacturing method thereof

A method for manufacturing a packaged component with a composite pin structure, comprising:

• preparing a substrate and dividing the substrate into a body area and a pin area, wherein the pin area is pre-defined with multiple pin positions, the substrate includes an insulation body having opposite surfaces, and at least one conductive layer is formed on each of the opposite surfaces;
• forming a chip placement opening and at least one conductive via in the body area;
• placing a chip into the chip placement opening;
• electrically connecting the chip to the at least one conductive layer of the substrate and the at least one conductive via;
• a protective layer covering the body area to form peripheral surfaces of a packaged component body;
• cutting along a periphery of the body area to form the packaged component body, and along a periphery of the multiple pin positions to form multiple pins extending from the packaged component body;
• wherein each pin comprises the insulation body and the at least one conductive layer on the opposite surfaces of the insulation body.