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US 12,224,226 B2Granted
Electronic device
AssigneeInnolux Corporation
InventorsChin-Lung Ting, Chung-Kuang Wei, Cheng-Chi Wang, Yeong-E Chen, Yi-Hung Lin
Life of this patent
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Abstract
An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.
Claims18
An electronic device, comprising:
- a circuit layer;
- an electronic element disposed on the circuit layer and electrically connected to the circuit layer;
- and
- a thermal conducting element disposed between the circuit layer and the electronic element,
- wherein the thermal conducting element is used for performing heat exchange with the electronic element,
- wherein the electronic element comprises a plurality of connectors, and a size of one of the plurality of connectors is different from a size of another one of the plurality of connectors.
3 more elements
An electronic device, comprising:
- a circuit layer;
- a connection pad disposed on the circuit layer;
- and
- an electronic element disposed on the circuit layer and electrically connected to the circuit layer,
- wherein the electronic element comprises a plurality of connectors, and the plurality of connectors are electrically connected to the connection pad,
- wherein a size of one of the plurality of connectors is different from a size of another one of the plurality of connectors.
3 more elements
An electronic device, comprising:
- a circuit layer;
- an electronic element disposed on the circuit layer and electrically connected to the circuit layer;
- and
- a first flow-path structure comprising a first flow path, wherein the electronic element is disposed in the first flow-path structure;
- and
- a fluid material disposed in the first flow path,
- wherein the fluid material is used for performing heat exchange with the electronic element,
- wherein the first flow-path structure comprises an input hole and an output hole, and the fluid material enters the first flow path through the input hole and exits the first flow path through the output hole.
5 more elements
Dependencies are inferred from the claim text.