Package structure with metallic layer over the surfaces of a plurality of semiconductor dies

A package structure, comprising:

• a first package component comprising:
• semiconductor dies, each of the semiconductor dies comprising a first surface and a second surface opposite to each other;
• an insulating encapsulation laterally encapsulating the semiconductor dies;
• and
• a redistribution structure underlying the first surfaces of the semiconductor dies and a first surface the insulating encapsulation, and the redistribution structure being electrically coupled to the semiconductor dies;
• a second package component underlying the first package component and electrically coupled to the semiconductor dies through the redistribution structure;
• an underfill layer disposed between the first and second package components and extending to cover a sidewall of the first package component;
• and
• a metallic layer overlying the second surfaces of the semiconductor dies and a second surface of the insulating encapsulation, and the metallic layer further extending to cover the underfill layer wherein the metallic layer is in physical contact with a sidewall of the insulating encapsulation of the first package component and extends to be in physical contact with an outer surface of the underfill layer.

A package structure, comprising:

• a first package component comprising:
• semiconductor dies;
• an insulating encapsulation laterally encapsulating the semiconductor dies;
• and
• a second package component underlying the first package component and electrically coupled to the semiconductor dies;
• an underfill layer disposed between the first and second package components;
• and
• a metallic layer overlying rear surfaces of the semiconductor dies and a surface of the insulating encapsulation, wherein the surface of the insulating encapsulation and the rear surfaces of the semiconductor dies are substantially leveled with one another, and a peripheral region of the surface of the insulating encapsulation is accessibly exposed by the metallic layer, wherein in a top view, the metallic layer comprises a rounded corner that corresponds to a rounded corner of the underfill layer.